<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:content="http://purl.org/rss/1.0/modules/content/"><channel><title>国产半导体 on AI 实战派 · 从技术到赚钱</title><link>https://guijiagi.com/tags/%E5%9B%BD%E4%BA%A7%E5%8D%8A%E5%AF%BC%E4%BD%93/</link><description>Recent content in 国产半导体 on AI 实战派 · 从技术到赚钱</description><generator>Hugo</generator><language>zh-cn</language><copyright>本站内容采用 CC BY-NC-SA 4.0 国际许可协议授权</copyright><lastBuildDate>Thu, 17 Sep 2026 00:00:00 +0000</lastBuildDate><atom:link href="https://guijiagi.com/tags/%E5%9B%BD%E4%BA%A7%E5%8D%8A%E5%AF%BC%E4%BD%93/index.xml" rel="self" type="application/rss+xml"/><item><title>深科技砸18.5亿扩产2.5D先进封装：新增1万片/月，国产封装抢食CoWoS溢出订单</title><link>https://guijiagi.com/posts/2026-09-17-chinamc-advanced-packaging-expansion/</link><pubDate>Thu, 17 Sep 2026 00:00:00 +0000</pubDate><guid>https://guijiagi.com/posts/2026-09-17-chinamc-advanced-packaging-expansion/</guid><description>深科技宣布投资18.5亿元扩产2.5D先进封装，新增产能1万片/月。在台积电CoWoS排到2027年的背景下，国产封测厂正在抢食溢出订单。</description></item></channel></rss>