<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:content="http://purl.org/rss/1.0/modules/content/"><channel><title>Chiplet on AI 实战派 · 从技术到赚钱</title><link>https://guijiagi.com/tags/chiplet/</link><description>Recent content in Chiplet on AI 实战派 · 从技术到赚钱</description><generator>Hugo</generator><language>zh-cn</language><copyright>本站内容采用 CC BY-NC-SA 4.0 国际许可协议授权</copyright><lastBuildDate>Mon, 05 Oct 2026 09:00:00 +0800</lastBuildDate><atom:link href="https://guijiagi.com/tags/chiplet/index.xml" rel="self" type="application/rss+xml"/><item><title>先进封装：AI芯片的新战场</title><link>https://guijiagi.com/posts/2026-10-05-ai-chip-advanced-packaging/</link><pubDate>Mon, 05 Oct 2026 09:00:00 +0800</pubDate><guid>https://guijiagi.com/posts/2026-10-05-ai-chip-advanced-packaging/</guid><description>制程逼近物理极限，封装成为性能突破口 AI芯片需要集成更多HBM Chiplet成为算力扩展主流方案 英伟达GPU标配 产能紧张，供不应求</description></item></channel></rss>